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LEXAN PC HP1 Resin物性表

LEXAN PC HP1 Resin物性表
比重
ASTM D792
--
1.20
g/cm³
--
1.19
g/cm³
特定体积
0.830
cm³/g
ASTM D792
熔流率 (300°C/1.2 kg)
25
g/10 min
ASTM D1238
LEXAN PC HP1 Resin物性表详情见附件

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OTHER PRODUCTS
KIBISAN PN
Acrylonitrile Butadiene Styrene/Polyethylene Terephthalate (ABS/PET) B7052(
Epoxy Molding Compound (EP - Molding) CEL-400ZHF16 UL黄卡
Polytetrafluorethylene (PTFE) M-25 UL黄卡
Polyamide 66 (PA66) PA66-R10G15 (##), PA66-RG151(ddd) UL黄卡
Polycarbonate (PC) SD2201W UL黄卡
Polyurethane (PUR) UF-400, SU-500 UL黄卡
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EVA-诺雪姆化学-4852
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