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RTP Compounds pc 300 GB 10 TFE 15 EM物性表

RTP Compounds  pc 300 GB 10 TFE 15 EM物性表
率 - 流动 (3.18 mm)
0.60 到 0.80
%
ASTM D955

机械性能额定值
单位制
测试方法
拉伸模量
2410
MPa
ASTM D638
抗张强度
41.4
MPa
ASTM D638
伸长率 (屈服)
> 10
%
ASTM D638
弯曲模量
2410
MPa
ASTM D790
弯曲强度

RTP Compounds  pc 300 GB 10 TFE 15 EM物性表 见图片      

RTP Compounds  pc 300 GB 10 TFE 15 EM 塑胶原料更多详情,PC专家,可来电咨询赵先生:13424755533  QQ:27660005

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Epoxy Molding Compound (EP - Molding) EME-G770, EME-G770S, EME-G770G,EME-G7
Polycarbonate (PC) GMB10(##)N+ UL黄卡
Polypropylene (PP) FH1200 UL黄卡
Silicone Rubber (SIR) KU-TCAB(xxxx) (CC,#,%) UL黄卡
Polystyrene (PS) 1280 UL黄卡
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